Contents:
Shashank S. Advanced Materials Technologies , 3 7 , Yiqi Lai, Jonathan R. Thompson, Mita Dasog. Chemistry - A European Journal , 24 31 , Gereau, Xing Sheng, John A. Advanced Energy Materials , 8 16 , Lagally, Yongfeng Mei. Materials Science and Engineering: R: Reports , , Kazmierczak, J. Flesch, J. Mitzloff, G. Capellini, W. Klesse, O. Skibitzki, C. You, M. Bettenhausen, B.
Witzigmann, J. Piehler, T. Schroeder, S. Journal of Applied Physics , 17 , Bochao Lu, Michel M. Germanium as a scalable sacrificial layer for nanoscale protein patterning.
Qurrat Shabir. Biodegradability of Porous Silicon. Xian Huang. Materials and applications of bioresorbable electronics. Journal of Semiconductors , 39 1 , Lan Yin, Xing Sheng. Nonconventional Biosensors Based on Nanomembrane Materials.
Recent progress on biodegradable materials and transient electronics. Bioactive Materials , DOI: Bioresorbable Materials and Their Application in Electronics. Materials and processing approaches for foundry-compatible transient electronics. Biocompatibility of GaSb thin films grown by RF magnetron sputtering. Applied Surface Science , , Heliyon , 3 7 , e Protein patterning using germanium as a sacrificial layer.
High-performance green semiconductor devices: materials, designs, and fabrication.
Semiconductor Science and Technology , 32 6 , Yuyan Gao, Huanyu Cheng. Journal of Electronic Packaging , 2 , Graham J. Triggs, Gareth J. Evans, Thomas F. Degradation of silicon photonic biosensors in cell culture media: analysis and prevention. Biomedical Optics Express , 8 6 , Stencil Lithography for Scalable Micro- and Nanomanufacturing. Micromachines , 8 4 , Pagaduan, Ishan Barman, David H. Angewandte Chemie , 14 , Angewandte Chemie International Edition , 56 14 , Electronic Devices for Human-Machine Interfaces.
Advanced Materials Interfaces , 4 4 , Transfer Printing for Cyber-Manufacturing Systems. High performance transient organic solar cells on biodegradable polyvinyl alcohol composite substrates. RSC Advances , 7 83 , Huanyu Cheng, Ning Yi. Dissolvable tattoo sensors: from science fiction to a viable technology. Physica Scripta , 92 1 , Clementine M.
Boutry, Bob C. A sensor measuring deformation and pressure, entirely biodegradable, for orthopedic applications. Huanyu Cheng. Inorganic dissolvable electronics: materials and devices for biomedicine and environment. Journal of Materials Research , 31 17 , Huanyu Cheng, Vikas Vepachedu. Recent development of transient electronics. Theoretical and Applied Mechanics Letters , 6 1 , Sonu Hooda, B.
Kanjilal, D. An ideal reference work for students and scientists working in the field of physics of semiconductor devices and materials, as well as for engineers in research centres and industry. Both the newcomer and the expert should benefit from this unique book.
For a wide audience including students, scientists, process engineers, material manufacturers, semiconductor research centres and universities. Introduction C. Claeys, E. Chapter 1. Germanium Materials B. Depuyt et al. Chapter 2. Grown-in Defects in Ge J. Vanhellemont et al. Chapter 3. Diffusion and Solubility of Dopants in Germanium E. Simoen, C. Chapter 4. Oxygen in Germanium P. Chapter 5. Metals in Germanium E. Chapter 6. Ab- initio Modelling of Defects in Germanium R.
By continuing to use this site you agree to our use of cookies. Lin C. PhD thesis, Mass. Caymax et al. The approach of capping the GeO x with a layer of diffusion-resistant high-k material is an excellent step in achieving this. Bojarczuk N.
Jones, J. Chapter 7. Radiation Performance of Ge Technologies V.
Markevich et al. Chapter 8.
Electrical Performance of Devices M. Houssa et al. Chapter 9.
Device Modeling D. Esseni et al. Chapter On Chui, K. Alternative Ge Applications. Trends and Outlook E. Eddy Simoen is a Senior Researcher at IMEC, where he is currently involved in research on the defect and strain engineering in high-mobility and epitaxial substrates and defect studies in germanium and III-V compounds. We are always looking for ways to improve customer experience on Elsevier.